Ofthe 458 licensing agreements, 91% were unilateral licensing, while 9% of all the licensing agreements were cross-licensing agreements. About 53% of the licensing agreements were signed between chipless firms and other semiconductor industry participants (SIC 367_, IDM’s). Other industry participants with whom chipless firm entered into licensing agreements included: computer firms and all SIC 35 firms accounting for around10.3%,software and services firms 11.6 %, all others electronics/comm equips firms 9%, automobile/ Aerospace firms 1.1%, Photographic equip firms0.4% andfirms form all other industry sectors 12.4%. These figures indicate the networked nature of chipless firms licensing engagements and their extensive use of cross and unilateral
Ofthe 458 licensing agreements, 91% were unilateral licensing, while 9% of all the licensing agreements were cross-licensing agreements. About 53% of the licensing agreements were signed between chipless firms and other semiconductor industry participants (SIC 367_, IDM’s). Other industry participants with whom chipless firm entered into licensing agreements included: computer firms and all SIC 35 firms accounting for around10.3%,software and services firms 11.6 %, all others electronics/comm equips firms 9%, automobile/ Aerospace firms 1.1%, Photographic equip firms0.4% andfirms form all other industry sectors 12.4%. These figures indicate the networked nature of chipless firms licensing engagements and their extensive use of cross and unilateral